High-temperature weather is inseparable from heat dissipation, and strong heat dissipation can support longer-term high performance. The performance and heat dissipation of the whole series of HARDTOU products have been greatly improved, especially with the blessing of HARDTOU heat dissipation technology, the temperature of the whole stack of products can always be kept in a comfortable range, thereby bringing a better user experience.
The whole series of HARDTOU tablets for high temperature are not only adopt the internal compact structure design to leave more space for heat dissipation, but also achieve more efficient heat conduction through two modes of active cooling and passive cooling, so you don’t have to worry about the down-frequency card after high temperature or long-term use pause.
Active cooling mode: HARDTOU tablets for high temperature based on the Intel Alder Lake platform 12th generation Core and Tiger Lake platform 11th generation Core processors are equipped with a heat conduction layer + heat dissipation layer. The former is a heat pipe and heat sink, and the latter is a fan and cooling holes. The heat of the core components is transferred to the heat sink through the heat pipe, and then forced out from the cooling holes by the fan. This active cooling mode can conduct the heat out faster. In addition, HARDTOU's heat pipes and heat sinks use high thermal conductivity materials and large-size shapes to effectively expand the heat exchange rate and area. The fans use large-area high-speed fans, and the heat dissipation holes use air ducts to guide heat to quickly complete heat exchange. , to achieve an all-round improvement of the cooling effect.
